Electroplating process - List of Manufacturers, Suppliers, Companies and Products

Introduction to 3D Photolithography Processing Technology

Processing technology using "electrolytic plating"!

"3D Photolithography" is a processing technology that can uniformly form a resist film on any conductive surface. It was developed using "electroplating," which involves immersing the entire substrate in a liquid phase to deposit a metal film. This technology enables photolithography processing to be applied to the entire three-dimensional shape, including edges and corners. [Features] - Uniform formation of resist film on any conductive surface - Utilizes "electroplating" - Photolithography processing possible on the entire three-dimensional shape, including edges and corners *For more details, please refer to the catalog or feel free to contact us.

Company：フォトプレシジョン
Price：Other

Technology Development

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Introduction to "Low Reflective Plating" Electroforming Technology

Surface treatment using plating to prevent light reflection, enabling ultra-fine processing at the micron level! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that allows for the high-precision shaping of metal products by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to overlap the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the molding of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.