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Introduction to 3D Photolithography Processing Technology

Processing technology using "electrolytic plating"!

"3D Photolithography" is a processing technology that can uniformly form a resist film on any conductive surface. It was developed using "electroplating," which involves immersing the entire substrate in a liquid phase to deposit a metal film. This technology enables photolithography processing to be applied to the entire three-dimensional shape, including edges and corners. [Features] - Uniform formation of resist film on any conductive surface - Utilizes "electroplating" - Photolithography processing possible on the entire three-dimensional shape, including edges and corners *For more details, please refer to the catalog or feel free to contact us.

  • Technology Development
  • Electroplating process

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Introduction to "Low Reflective Plating" Electroforming Technology

Surface treatment using plating to prevent light reflection, enabling ultra-fine processing at the micron level! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that allows for the high-precision shaping of metal products by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to overlap the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] - Enables ultra-fine processing at the micron level, which is difficult with etching - Reduces initial costs by eliminating the need for molds, allowing for the molding of three-dimensional cross-sectional shapes - Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Electroplating process

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